微小化
微小化現今變得更加重要，特別是對於移動設備，物聯網（iot）和可穿戴電子產品。通過我們微小化解決方案，可以減小大多數電子系統尺寸以滿足市場需求。
微小化技術帶來的優點。
- 縮小產品xy尺寸提供更多的空間給電池有更多和整合更多的功能
- 減少零件高度(z)和重量讓產品更輕薄時尚
- 降地產品組裝測試和包裝的難度
- 提升訊號整合
- 可屏蔽電磁波的干擾
- 加速開發時程
- 較高的可靠度-抗潮濕和抗腐蝕性
- 更便於運輸及庫存管理
微小化
there are four key technologies about how to reduce xy area.
- use small foot print components: such as 01005 passive smds, fine pitch wlcsp, qfn ic package and reduce components space. this is "high density smt technology”.
- put components on both sides of substrate with special package architectures. this is "dual side molding technology”.
- stack memory chips together on memory controller ic and wire bond together. this is "3d stack die technology”.
- bury smds or ic chips inside substrate layers can reduce xy area also. this is "embedded in substrate technology”.
high density smt
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high density smt
