微小化
微小化现今变得更加重要，特别是对于移动设备，物联网（iot）和可穿戴电子产品。通过我们微小化ag真人试玩2000的解决方案，可以减小大多数电子系统尺寸以满足市场需求。
微小化技术带来的优点。
- 缩小产品xy尺寸提供更多的空间给电池有更多和整合更多的功能
- 减少零件高度(z)和重量让产品更轻薄时尚
- 降地产品组装测试和包装的难度
- 提升讯号整合
- 可屏蔽电磁波的干扰
- 加速开发时程
- 较高的可靠度-抗潮湿和抗腐蚀性
- 更便于运输及库存管理
微小化
there are four key technologies about how to reduce xy area.
- use small foot print components: such as 01005 passive smds, fine pitch wlcsp, qfn ic package and reduce components space. this is "high density smt technology”.
- put components on both sides of substrate with special package architectures. this is "dual side molding technology”.
- stack memory chips together on memory controller ic and wire bond together. this is "3d stack die technology”.
- bury smds or ic chips inside substrate layers can reduce xy area also. this is "embedded in substrate technology”.
high density smt
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high density smt
