微小化
微小化现今变得更加重要，特别是对于移动设备，物联网（iot）和可穿戴电子产品。通过我们微小化ag真人试玩2000的解决方案，可以减小大多数电子系统尺寸以满足市场需求。
微小化技术带来的优点。
- 缩小产品xy尺寸提供更多的空间给电池有更多和整合更多的功能
- 减少零件高度(z)和重量让产品更轻薄时尚
- 降地产品组装测试和包装的难度
- 提升讯号整合
- 可屏蔽电磁波的干扰
- 加速开发时程
- 较高的可靠度-抗潮湿和抗腐蚀性
- 更便于运输及库存管理
微小化
encapsulation provides an economical way to protect device packages by isolating the active devices from environmental pollutants. at the same time, it offers mechanical protection by structural coupling of the device to the constituent packaging materials into a robust package. transfer molding which includes selective molding and dual molding is normally used encapsulation.
dual side molding
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dual side mold with filling molding via
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dual side molding exposed ball
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dual side mold with substrate interposer
